INTEGRATED CIRCUITS

DATA SHEET

TDA8395 SECAM decoder Preliminary specification File under Integrated Circuits, IC02

October 1991

Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

FEATURES • Fully integrated filters • Alignment free • For use with baseband delay GENERAL DESCRIPTION The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with the PAL/NTSC decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC incorporates HF and LF filters, a demodulator and an identification circuit (luminance is not processed in this IC). The IC needs no adjustments and very few external components are required. A highly stable reference frequency is required for calibration and a two-level sandcastle pulse for blanking and burst gating. QUICK REFERENCE DATA SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

VP

positive supply voltage; pin 3

7.2

−

8.8

V

Ptot

total power dissipation

−

−

220

mW

V16(p-p)

composite video input voltage (peak-to-peak value); pin 16

−

1.0

1.5

V

VO(p-p)

−(R−Y) output voltage amplitude (peak-to-peak value); pin 9

−

1.05

−

V

VO(p-p)

−(B−Y) output voltage amplitude (peak-to-peak value); pin 10

−

1.33

−

V

ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA8395

PINS

PIN POSITION

MATERIAL

CODE

16

DIL

plastic

SOT38GE1(1)

Note 1. SOT38-1; 1996 December 3.

October 1991

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Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

Fig.1 Block diagram.

PINNING SYMBOL

Fig.2 Pin configuration

October 1991

3

PIN

DESCRIPTION

fref/ IDENT

1

reference frequency input/identification input

TEST

2

test output

VP

3

positive supply voltage

n.c.

4

not connected

n.c.

5

not connected

GND

6

ground

CLOCHEref

7

Cloche reference filter

PLLref

8

PLL reference

−(R−Y)

9

−(R−Y) output

−(B−Y)

10

−(B−Y) output

n.c.

11

not connected

n.c.

12

not connected

n.c.

13

not connected

n.c.

14

not connected

SAND

15

sandcastle pulse input

CVBS

16

video (chrominance) input

Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395 colour-on is transmitted to pin 1 (current is sunk). If the signal request is granted (i.e. pin 1 is HIGH therefore no PAL) the colour difference outputs (−(B−Y) and −(R−Y)) from the TDA8362 are high impedance and the output signals from the TDA8395 are switched ON.

FUNCTIONAL DESCRIPTION The TDA8395 is a self-calibrating SECAM decoder designed for use with a baseband delay circuit. During frame retrace a 4.433619 MHz reference frequency is used to calibrate the filters and the demodulator. The reference frequency should be very stable during this period.

If no SECAM signal is decoded during a two-frame period the demodulator will be initialized before another attempt is made also during a two-frame period. The CD outputs will be blanked or high-impedance depending on the logic level at pin 1.

The Cloche filter is a gyrator-capacitor type filter the resonance frequency of which is controlled during the calibration period and offset during scan; this ensures the correct frequency during calibration.

A two-level sandcastle pulse generates the required blanking periods and, also, clocks the digital identification pulse on the falling edge of the burst gate pulse. To enable the calibration period to be defined the vertical retrace is discriminated from the horizontal retrace, this is achieved by measuring the width of the blanking period.

The demodulator is a Phase-Locked Loop (PLL) type demodulator which uses the frequency reference and the bandgap reference to force the PLL to the required demodulation characteristic. The low frequency de-emphasis is matched to the PLL and is controlled by the tuning voltage of the PLL. A digital identification circuit scans the incoming signal for SECAM (only line-identification is implemented). The identification circuit needs to communicate with the TDA8362 to guarantee that the output signal from the decoder is only available when no PAL signal has been identified. If a SECAM signal is decoded a request for LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134) SYMBOL

PARAMETER

MIN.

MAX.

UNIT

VP

positive supply voltage

−

8.8

V

Tstg

storage temperature range

−25

+150

°C

Tamb

operating ambient temperature range

−25

+70

°C

October 1991

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Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

CHARACTERISTICS VP = 8.0 V; Tamb = 25 °C; unless otherwise specified SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (pin 3) VP

positive supply voltage

7.2

8.0

8.8

V

IP

supply current

−

18

25

mA

Ptot

total power dissipation

−

144

220

mW

−

1.0

1.5

V

CVBS input (pin 16) V16(p-p)

composite video input voltage (peak-to-peak value)

V16(p-p)

chrominance input voltage (peak-to-peak value)

note 1

15

−

300

mV

ZI

input impedance

note 2

−

15

−

kΩ

2.5

3.5

4.5

V

CLOCHE (pin 7) Vtc

tuning voltage

f0

resonance frequency

B

bandwidth

note 3

4.266

4.286

4.306

MHz

241

268

295

kHz

Demodulator Vtd

tuning voltage; pin 8

3.5

−

4.8

V

VO(p-p)

output voltage amplitude (peak-to-peak value); pin 9

100/75 colour bar

0.97

1.05

1.13

V

VO(p-p)

output voltage amplitude (peak-to-peak value); pin 10

100/75 colour bar

1.23

1.33

1.43

V

NLE

non-linearity error

100/75 colour bar; note 4

−

−

3

%

1.23

1.27

1.32

−

5

kHz

−(B−Y)/−(R−Y) ratio of −(B−Y) and −(R−Y) fbe−(R−Y)

black-level error −(R−Y)

note 5

−

fbe−(B−Y)

black-level error −(B−Y)

note 5

−

−

7

kHz

VO

output voltage level during blanking

−

2.8

−

V

BO

output bandwidth

−

1.3

−

MHz

S/N

signal-to-noise ratio

40

−

−

dB

fp

pole-frequency LF de-emphasis

77

85

93

kHz

fp/f0

ratio of pole and zero frequency

−

3

−

Vrh(p-p)

residual harmonic voltage (peak-to-peak value)

−

−

10

mV

ZO(e)

output impedance SECAM enabled

pin 1 HIGH

−

−

600

Ω

ZO(d)

output impedance SECAM disabled

pin 1 LOW

1

−

−

MΩ

October 1991

note 6

5

Philips Semiconductors

Preliminary specification

SECAM decoder

SYMBOL

PARAMETER

TDA8395

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Sandcastle pulse Vbl

blanking detection level

1.0

1.25

1.5

V

Vbg

burst gate detection level

3.5

3.85

4.2

V

tf

falling edge of burst gate to start sync

8.5

9.0

9.5

µs

−

4.4336

−

MHz

Reference/communication fref

reference frequency

note 7

Vref(p-p)

reference voltage amplitude (peak-to-peak value)

0.20

−

0.50

V

Ved

SECAM enable detection level; pin 1

−

2.8

3.3

V

Vdd

SECAM disabled detection level; pin 1

note 8

1.5

2.0

−

V

Is

sink current at SECAM identification; pin 1

note 9

−

150

−

µA

Identification ti

identification time

−

4

−

frames

H

colour on/off hysteresis

3

−

−

dB

Notes to the characteristics 1. If measured in the burst-period of a blue line. 2. The video input is AC-coupled. 3. During scan. 4. Measured as 100% x (IVuI - IVII) / (IVuI + IVlI); see Fig.3. 5. Converted to input frequency error. 6. Defined as the ratio between the peak-to-peak value of the B−Y component of the demodulated 100/75 colour bar and the peak-to-peak value of the noise. 7. The reference should be stable during frame blanking. 8. The SECAM enable and disable timing should preferably be at the end of the frame blanking. 9. The externally supplied voltage should exceed 0.5 V.

October 1991

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Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

Fig.3 Non-linearity definition.

TIMING

Fig.4 Timing waveforms.

October 1991

7

Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

APPLICATION INFORMATION The leakage current at pin 8 should be well below 20 nA to meet the specification of the black levels (C8 = 220 nF). The leakage current at pin 7 should be well below 60 nA to meet the specification of the Cloche resonance frequency (C7 = 100 nF). The capacitors C7 and C8 should be connected to the ground pin as close as possible to the package. If not, this can result in a black level error for both channels. TEST INFORMATION The performance of the Cloche filter can be measured at pin 2. The use of a FET-probe is advised for low capacitive loading.

October 1991

8

Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

ME

seating plane

D

A2

A

A1

L

c e

Z

b1

w M (e 1)

b MH

9

16

pin 1 index E

1

8

0

5

10 mm

scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT

A max.

A1 min.

A2 max.

b

b1

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1) max.

mm

4.7

0.51

3.7

1.40 1.14

0.53 0.38

0.32 0.23

21.8 21.4

6.48 6.20

2.54

7.62

3.9 3.4

8.25 7.80

9.5 8.3

0.254

2.2

inches

0.19

0.020

0.15

0.055 0.045

0.021 0.015

0.013 0.009

0.86 0.84

0.26 0.24

0.10

0.30

0.15 0.13

0.32 0.31

0.37 0.33

0.01

0.087

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES

OUTLINE VERSION

IEC

JEDEC

SOT38-1

050G09

MO-001AE

October 1991

EIAJ

EUROPEAN PROJECTION

ISSUE DATE 92-10-02 95-01-19

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Philips Semiconductors

Preliminary specification

SECAM decoder

TDA8395

SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

October 1991

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