Rev.0.2, May. 2010 K9F4G08U0D K9K8G08U0D K9K8G08U1D K9WAG08U1D
Advance
4Gb D-die NAND Flash Single-Level-Cell (1bit/cell)
datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved.
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
datasheet
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FLASH MEMORY
Revision History Revision No.
History
Draft Date
Remark
Editor
0.0
1. Initial issue
Jan. 12, 2010
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0.1
1. Corrected errata. 2. Chapter 1.2 Features revised.
May. 03, 2010
Advance
H.K.Kim
0.2
1. DDP/QDP Part ID are added.
May. 26, 2010
Advance
H.K.Kim
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near your office.
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
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FLASH MEMORY
Table Of Contents 1.0 INTRODUCTION ........................................................................................................................................................ 4 1.1 General Description................................................................................................................................................. 4 1.2 Features .................................................................................................................................................................. 4 1.3 PRODUCT LIST ...................................................................................................................................................... 4 1.4 Pin Configuration (TSOP1) ...................................................................................................................................... 5 1.4.1 PACKAGE DIMENSIONS ................................................................................................................................. 5 1.5 Pin Configuration (TSOP1) ...................................................................................................................................... 6 1.5.1 PACKAGE DIMENSIONS ................................................................................................................................. 6 1.6 Pin Description ........................................................................................................................................................ 7 2.0 PRODUCT INTRODUCTION...................................................................................................................................... 9 2.1 Absolute Maximum Ratings ..................................................................................................................................... 10 2.2 Recommended Operating Conditions ..................................................................................................................... 10 2.3 DC AND OPERATING CHARACTERISTICS(Recommended operating conditions otherwise noted.) ..................10 2.4 Valid Block............................................................................................................................................................... 11 2.5 Ac Test Condition .................................................................................................................................................... 11 2.6 Capacitance(TA=25°C, VCC=3.3V, f=1.0MHz) ....................................................................................................... 11 2.7 Mode Selection........................................................................................................................................................ 11 2.8 Program / Erase Characteristics ........................................................................................................................12 2.9 AC Timing Characteristics for Command / Address / Data Input ............................................................................ 12 2.10 AC Characteristics for Operation........................................................................................................................... 13 3.0 NAND Flash Technical Notes .................................................................................................................................... 14 3.1 Initial Invalid Block(s) ............................................................................................................................................... 14 3.2 Identifying Initial Invalid Block(s) ............................................................................................................................. 14 3.3 Error in write or read operation................................................................................................................................ 15 3.4 Addressing for program operation ........................................................................................................................... 17 3.5 System Interface Using CE don’t-care. ................................................................................................................... 18 4.0 TIMING DIAGRAMS .................................................................................................................................................. 19 4.1 Command Latch Cycle ........................................................................................................................................... 19 4.2 Address Latch Cycle............................................................................................................................................... 19 4.3 Input Data Latch Cycle ........................................................................................................................................... 20 4.4 * Serial Access Cycle after Read(CLE=L, WE=H, ALE=L)..................................................................................... 20 4.5 Serial Access Cycle after Read(EDO Type, CLE=L, WE=H, ALE=L) .................................................................... 21 4.6 Status Read Cycle .................................................................................................................................................. 21 4.7 Read Operation ...................................................................................................................................................... 22 4.8 Read Operation(Intercepted by CE) ....................................................................................................................... 22 4.9 Random Data Output In a Page ............................................................................................................................. 23 4.10 Page Program Operation...................................................................................................................................... 24 4.11 Page Program Operation with Random Data Input .............................................................................................. 25 4.12 Copy-Back Program Operation ............................................................................................................................ 26 4.13 Copy-Back Program Operation with Random Data Input ..................................................................................... 27 4.14 Two-Plane Page Program Operation ................................................................................................................... 28 4.15 Block Erase Operation.......................................................................................................................................... 29 4.16 Two-Plane Block Erase Operation ....................................................................................................................... 30 4.17 Read ID Operation................................................................................................................................................ 31 5.0 DEVICE OPERATION ................................................................................................................................................ 33 5.1 Page Read............................................................................................................................................................... 33 5.2 Page Program ......................................................................................................................................................... 34 5.3 Copy-back Program................................................................................................................................................. 35 5.4 Block Erase ............................................................................................................................................................. 36 5.5 Two-plane Page Program........................................................................................................................................ 36 5.6 Two-plane Block Erase............................................................................................................................................ 37 5.7 Two-plane Copy-back Program ............................................................................................................................... 37 5.8 Read Status............................................................................................................................................................. 39 5.9 Read ID ................................................................................................................................................................... 40 5.10 Reset ..................................................................................................................................................................... 40 5.11 Ready/Busy ........................................................................................................................................................... 41 5.12 Data Protection & Power Up Sequence ................................................................................................................ 42
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
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FLASH MEMORY
1.0 INTRODUCTION 1.1 General Description Offered in 512Mx8bit, the K9F4G08U0D is a 4G-bit NAND Flash Memory with spare 128M-bit. The device is offered in 3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state application market. A program operation can be performed in typical 250μs on the (2K+64)Byte page and an erase operation can be performed in typical 2ms on a (128K+4K)Byte block. Data in the data register can be read out at 25ns cycle time per Byte. The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F4G08U0D′s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm. The K9F4G08U0D is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.
1.2 Features • Command/Address/Data Multiplexed I/O Port • Hardware Data Protection - Program/Erase Lockout During Power Transitions • Reliable CMOS Floating-Gate Technology - ECC Requirement : 1bit/528Byte - Endurance & Data Retention : Please refer to the qualification report • Command Register Operation • Unique ID for Copyright Protection • Package : - K9F4G08U0D-SCB0/SIB0 : Pb-FREE, Halogen-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch) - K9K8G08U0D-SCB0/SIB0 : Pb-FREE, Halogen-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch) - K9K8G08U1D-SCB0/SIB0 : Pb-FREE, Halogen-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch) - K9WAG08U1D-SCB0/SIB0 : Pb-FREE, Halogen-FREE PACKAGE 48 - Pin TSOP1 (12 x 20 / 0.5 mm pitch)
• Voltage Supply - 3.3V Device(K9F4G08U0D) : 2.7V ~ 3.6V • Organization - Memory Cell Array : (512M + 16M) x 8bit - Data Register : (2K + 64) x 8bit • Automatic Program and Erase - Page Program : (2K + 64)Byte - Block Erase : (128K + 4K)Byte • Page Read Operation - Page Size : (2K + 64)Byte - Random Read : 25μs(Max.) - Serial Access : 25ns(Min.) • Fast Write Cycle Time - Page Program time : 250μs(Typ.) - Block Erase Time : 2ms(Typ.)
1.3 PRODUCT LIST Part Number
Vcc Range
Organization
PKG Type
2.70 ~ 3.60V
X8
TSOP1
K9F4G08U0D-S K9K8G08U0D-S K9K8G08U1D-S K9WAG08U1D-S
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
FLASH MEMORY
1.4 Pin Configuration (TSOP1) K9F4G08U0D-SCB0/SIB0 K9K8G08U0D-SCB0/SIB0 N.C N.C N.C N.C N.C N.C R/B1 RE CE1 N.C N.C Vcc Vss N.C N.C CLE ALE WE WP N.C N.C N.C N.C N.C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
48-pin TSOP1 Standard Type 12mm x 20mm
N.C N.C N.C N.C I/O7 I/O6 I/O5 I/O4 N.C N.C N.C Vcc Vss N.C N.C N.C I/O3 I/O2 I/O1 I/O0 N.C N.C N.C N.C
1.4.1 PACKAGE DIMENSIONS 48-PIN LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I) Unit :mm/Inch 0.10 MAX 0.004
48 - TSOP1 - 1220F
#48
#24
#25
0.50 0.0197
12.40 0.488 MAX
( 0.25 ) 0.010
#1
12.00 0.472
+0.003
0.008-0.001
0.20 -0.03
+0.07
20.00±0.20 0.787±0.008
+0.075
0~8°
0.45~0.75 0.018~0.030
+0.003 0.005-0.001
18.40±0.10 0.724±0.004
0.125 0.035
0.25 0.010 TYP
1.00±0.05 0.039±0.002
( 0.50 ) 0.020
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1.20 0.047MAX
0.05 0.002 MIN
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datasheet
K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
FLASH MEMORY
1.5 Pin Configuration (TSOP1) K9K8G08U1D-SCB0/SIB0 K9WAG08U1D-SCB0/SIB0 N.C N.C N.C N.C N.C R/B2 R/B1 RE CE1 CE2 N.C Vcc Vss N.C N.C CLE ALE WE WP N.C N.C N.C N.C N.C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
48-pin TSOP1 Standard Type 12mm x 20mm
N.C N.C N.C N.C I/O7 I/O6 I/O5 I/O4 N.C N.C N.C Vcc Vss N.C N.C N.C I/O3 I/O2 I/O1 I/O0 N.C N.C N.C N.C
1.5.1 PACKAGE DIMENSIONS 48-PIN LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(I) Unit :mm/Inch 0.10 MAX 0.004
48 - TSOP1 - 1220F
#48
#24
#25
0.50 0.0197
12.40 0.488 MAX
( 0.25 ) 0.010
#1
12.00 0.472
+0.003
0.008-0.001
0.20 -0.03
+0.07
20.00±0.20 0.787±0.008
+0.075
0~8°
0.45~0.75 0.018~0.030
+0.003 0.005-0.001
18.40±0.10 0.724±0.004
0.125 0.035
0.25 0.010 TYP
1.00±0.05 0.039±0.002
( 0.50 ) 0.020
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1.20 0.047MAX
0.05 0.002 MIN
K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
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FLASH MEMORY
1.6 Pin Description Pin Name
Pin Function
I/O0 ~ I/O7
DATA INPUTS/OUTPUTS The I/O pins are used to input command, address and data, and to output data during read operations. The I/O pins float to high-z when the chip is deselected or when the outputs are disabled.
CLE
COMMAND LATCH ENABLE The CLE input controls the activating path for commands sent to the command register. When active high, commands are latched into the command register through the I/O ports on the rising edge of the WE signal.
ALE
ADDRESS LATCH ENABLE The ALE input controls the activating path for address to the internal address registers. Addresses are latched on the rising edge of WE with ALE high.
CE
CHIP ENABLE The CE input is the device selection control. When the device is in the Busy state, CE high is ignored, and the device does not return to standby mode in program or erase operation.
RE
READ ENABLE The RE input is the serial data-out control, and when active drives the data onto the I/O bus. Data is valid tREA after the falling edge of RE which also increments the internal column address counter by one.
WE
WRITE ENABLE The WE input controls writes to the I/O port. Commands, address and data are latched on the rising edge of the WE pulse.
WP
WRITE PROTECT The WP pin provides inadvertent program/erase protection during power transitions. The internal high voltage generator is reset when the WP pin is active low.
R/B
READY/BUSY OUTPUT The R/B output indicates the status of the device operation. When low, it indicates that a program, erase or random read operation is in process and returns to high state upon completion. It is an open drain output and does not float to high-z condition when the chip is deselected or when outputs are disabled.
Vcc
POWER VCC is the power supply for device.
Vss
GROUND
N.C
NO CONNECTION Lead is not internally connected.
NOTE : Connect all VCC and VSS pins of each device to common power supply outputs. Do not leave VCC or VSS disconnected.
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
FLASH MEMORY
VCC VSS A12 - A29
X-Buffers Latches & Decoders
4,096M + 128M Bit NAND Flash ARRAY
A0 - A11
Y-Buffers Latches & Decoders
(2,048 + 64)Byte x 262,144 Data Register & S/A Y-Gating
Command Command Register
CE RE WE
VCC VSS
I/O Buffers & Latches
Control Logic & High Voltage Generator
Output Driver
Global Buffers
I/0 0
I/0 7 CLE ALE WP
[Figure 1] K9F4G08U0D Functional Block Diagram
1 Block = 64 Pages (128K + 4K) Byte
1 Page = (2K + 64)Bytes 1 Block = (2K + 64)B x 64 Pages = (128K + 4K) Bytes 1 Device = (2K+64)B x 64Pages x 4,096 Blocks = 4,224 Mbits
256K Pages (=4,096 Blocks) 8 bit 2K Bytes
64 Bytes
I/O 0 ~ I/O 7
Page Register 2K Bytes
64 Bytes
[Figure 2] K9F4G08U0D Array Organization
I/O 0
I/O 1
1st Cycle
A0
A1
2nd Cycle
A8
A9
3rd Cycle
A12
A13
4th Cycle
A20
A21
5th Cycle
A28
A29
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
A2
A3
A4
A5
A6
A7
A10
A11
*L
*L
*L
*L
A14
A15
A16
A17
A18
A19
A22
A23
A24
A25
A26
A27
*L
*L
*L
*L
*L
*L
NOTE : Column Address : Starting Address of the Register. * L must be set to "Low". * The device ignores any additional input of address cycles than required.
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Column Address
Row Address : Page Address : A12 ~ A17 Plane Address : A18 Block Address : A19 ~ the last Address
datasheet
K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
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FLASH MEMORY
2.0 PRODUCT INTRODUCTION The K9F4G08U0D is a 4,224Mbit(4,429,185,024 bit) memory organized as 262,144 rows(pages) by 2,112x8 columns. Spare 64x8 columns are located from column address of 2,048~2,111. A 2,112-byte data register is connected to memory cell arrays accommodating data transfer between the I/O buffers and memory during page read and page program operations. The memory array is made up of 32 cells that are serially connected to form a NAND structure. Each of the 32 cells resides in a different page. A block consists of two NAND structured strings. A NAND structure consists of 32 cells. Total 1,081,344 NAND cells reside in a block. The program and read operations are executed on a page basis, while the erase operation is executed on a block basis. The memory array consists of 4,096 separately erasable 128K-byte blocks. It indicates that the bit by bit erase operation is prohibited on the K9F4G08U0D. The K9F4G08U0D has addresses multiplexed into 8 I/Os. This scheme dramatically reduces pin counts and allows system upgrades to future densities by maintaining consistency in system board design. Command, address and data are all written through I/O's by bringing WE to low while CE is low. Those are latched on the rising edge of WE. Command Latch Enable(CLE) and Address Latch Enable(ALE) are used to multiplex command and address respectively, via the I/O pins. Some commands require one bus cycle. For example, Reset Command, Status Read Command, etc require just one cycle bus. Some other commands, like page read and block erase and page program, require two cycles: one cycle for setup and the other cycle for execution. The 528M byte physical space requires 30 addresses, thereby requiring five cycles for addressing : 2 cycles of column address, 3 cycles of row address, in that order. Page Read and Page Program need the same five address cycles following the required command input. In Block Erase operation, however, only the three row address cycles are used. Device operations are selected by writing specific commands into the command register. Table 1 defines the specific commands of the K9F4G08U0D. In addition to the enhanced architecture and interface, the device incorporates copy-back program feature from one page to another page without need for transporting the data to and from the external buffer memory. Since the time-consuming serial access and data-input cycles are removed, system performance for solid-state disk application is significantly increased. [Table 1] Command Sets Function
1st Cycle
2nd Cycle
Read
00h
30h
Read for Copy Back
00h
35h
Read ID
90h
-
Reset
FFh
-
Page Program Two-Plane Page Program(2) Copy-Back Program Two-Plane Copy-Back Program(2) Block Erase Two-Plane Block Erase
80h
10h
80h---11h
81h---10h
85h
10h
85h---11h
81h---10h
60h
D0h
60h---60h
D0h
Random Data Input(1)
85h
-
Random Data Output(1)
05h
E0h
Acceptable Command during Busy
O
Read Status
70h
O
Read Status 2
F1h
O
NOTE : 1) Random Data Input/Output can be executed in a page. 2) Any command between 11h and 81h is prohibited except 70h/F1h and FFh.
Caution : Any undefined command inputs are prohibited except for above command set of Table 1.
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K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D
FLASH MEMORY
2.1 Absolute Maximum Ratings Parameter
Symbol
Rating
VCC
-0.6 to +4.6
Voltage on any pin relative to VSS
Temperature Under Bias Storage Temperature
K9XXG08XXD-XCB0
VIN
-0.6 to +4.6
VI/O
-0.6 to Vcc + 0.3 (< 4.6V)
K9XXG08XXD-XCB0 K9XXG08XXD-XIB0
V
-10 to +125
TBIAS
K9XXG08XXD-XIB0
Unit
°C
-40 to +125
TSTG
-65 to +150
°C
IOS
5
mA
Short Circuit Current
NOTE : 1) Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods
