ILX511 2048-pixel CCD Linear Image Sensor (B/W) Description The ILX511 is a rectangular reduction-type CCD linear image sensor designed for bar code POS hand scanner and optical measuring equipment use. A built-in timing generator and clock drivers ensure single 5V power supply for easy use. Features • Number of effective pixels: • Pixel size: • • • • •
2048 pixels 14µm x 200µm (14µm pitch)
22 -pin DIP (CERDIP)
Pin Configuration (Top View)
Single 5V power supply Ultra-high sensitivity Built-in timing generator and clock-drivers Built-in sample-and-hold circuit Maximum clock frequency: 2MHz
Absolute Maximum Ratings • Supply voltage VDD • Operating temperature • Storage temperature
6 –10 to +60 –30 to +80
VOUT
1
22
VDD
1
V °C °C
GND
2
21
VDD
GND
3
20
VDD
SHSW
4
19
GND
øCLK
5
18
VGG
VDD
6
17
GND
NC
7
16
GND
NC
8
15
VDD
VDD
9
14
NC
NC 10
13
NC
12
GND
øROG 11
2048
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E94108–TE
1
18
V OUT
VGG
20
21
22
13
14
15
16
17
S3 S2 S1 D32
D14 D13
–2– 7 NC
6 VDD
3 GND
GND
9 VDD
8 NC
øCLK
5
Clock Pulse Generator/ Sample-and-hold Pulse Generator
NC
10
Clock Drivers
19 SHSW GND
4
Mode Selector
CCD Analog Shift Register
Readout Gate
NC
NC
V DD
GND
GND
12
GND
øROG
11
Readout Gate Pulse Generator
D38 D37 D36 D35 D34 D33 S2048 S2047 S2046
2
Internal Structure Output Amplifier S/H Circuit
V DD
VDD
V DD
ILX511
Block Diagram
ILX511
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
Symbol VOUT GND GND SHSW øCLK VDD NC NC VDD NC øROG GND NC NC VDD GND GND VGG GND VDD VDD VDD
Description Signal output GND GND Switch (with S/H or without S/H) Clock pulse input 5V power supply NC NC 5V power supply NC Readout gate pulse input GND NC NC 5V power supply GND GND Output circuit gate bias GND 5V power supply 5V power supply 5V power supply
Mode Description
Recommended Voltage
Mode in Use With S/H Without S/H
Pin 4 (SHSW) GND VDD
Item VDD
Min. 4.5
Typ. 5.0
Max. 5.5
Input Clock Voltage Condition (Note) Item VIH VIL
Min. 4.5 0
Typ. 5.0 —
Max. 5.5 0.5
Unit V V
Note) This is applied to the all pulses applied externally (øCLK, øROG).
Input Pin Capacity Item Input capacity of øCLK pin Input capacity of øROG pin
Symbol CøCLK CøROG
Min. — —
–3–
Typ. 10 10
Max. — —
Unit pF pF
Unit V
ILX511
Electro-optical Characteristics (Ta = +25°C, VDD = 5V, Clock Frequency: 1MHz, Light Source = 3200K, IR Cut Filter: CM-500S (t = 1.0mm), Without S/H Mode) Item
Symbol
Min.
Typ.
Max.
Unit
Remarks
R1 R2 PRNU VSAT VDRK DSNU IL DR SE I VDD TTE ZO VOS
150 — — 0.6 — — — — — — 92.0 — —
200 1800 5.0 0.8 3.0 6.0 1 267 0.004 5.0 98.0 250 2.8
250 — 10.0 — 6.0 12.0 — — — 10.0 — — —
V/(lx • s) V/(lx • s) % V mV mV % — lx • s mA % Ω V
Note 1 Note 2 Note 3 — Note 4 Note 4 Note 5 Note 6 Note 7 — — — Note 8
Sensitivity 1 Sensitivity 2 Sensitivity nonuniformity Saturation output voltage Dark voltage average Dark signal nonuniformity Image lag Dynamic range Saturation exposure 5V current consumption Total transfer efficiency Output impedance Offset level
Notes: 1. For the sensitivity test light is applied with a uniform intensity of illumination. 2. Light source: LED λ = 660nm 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 1. PRNU =
4. 5. 6. 7. 8.
(VMAX-VMIN)/2 VAVE
x 100 (%)
The maximum output of all the valid pixels is set to V MAX , the minimum output to V MIN and the average output to VAVE. Integration time is 10ms. Typical value is used for clock pulse and readout pulse. VOUT = 500mV. DR = V SAT /V DRK . When optical integration time is shorter, the dynamic range sets wider because dark voltage is in proportion to optical integration time. SE = VSAT/R1 VOS is defined as indicated below.
D30
D31
D32
S1
V OUT
Vos
GND
–4–
*VOUT
øCLK
0
5
2
–5– D11
D10
D5
D4
1 D1
D30
D14
D13
S2048
S2047
S2045
S3
S2
Effective Picture Elements Signal (2048 pixels)
S4
D32 S1
D31
*Without S/H Mode (4-pin → V DD )
1-line Output Period (2086 pixels)
Optical Black (18 pixels)
S2046
D12
2088 or more clock pulses are required.
Dummy Signal (32 pixels)
D2
0
3 D3
øROG
2086 D37
D36
D35
D34
Dummy Signal (6 pixels)
D38
5
ILX511
Clock Timing Diagram (Without S/H Mode)
1
D33
V OUT
øCLK
0
5
2
–6– D9
D10
D5
D4
D3
D30
D13
D12
S2047
S2046
S3
S2
S1
Effective Picture Elements Signal (2048 pixels)
S4
D32
D31
1-line Output Period (2087 pixels)
Optical Black (18 pixels)
S2045
D11
2088 or more clock pulses are required.
Dummy Signal (33 pixels)
D1
1 D0
0
3 D2
øROG
2086 D36
D35
D34
Dummy Signal (6 pixels)
D37
5
ILX511
Clock Timing Diagram (With S/H Mode)
1 D38
S2048
D33
0
ILX511
øCLK Timing (For All Modes) t1
t2
øCLK
t4
t3
Item øCLK pulse rise/fall time øCLK pulse duty (Note 1)
Symbol t1, t2 —
Min. 0 40
Typ. 10 50
Max. 100 60
Unit ns %
Typ. 3000 3000 10 5000
Max. — — — —
Unit
Note 1) 100 x t4 / (t3 + t4)
øROG, øCLK Timing
øROG
t6
t8
t7
øCLK t9
t5
Item øROG,øCLK pulse timing 1 øROG,øCLK pulse timing 2 øROG pulse rise/fall time øROG pulse period
Symbol t5 t9 t6, t8 t7
Min. 0 1000 0 3000
–7–
ns
ILX511
øCLK, VOUT Timing (Note 1) (Note 3)
øCLK
t10
t11
VOUT
VOUT * (Note 2)
t12
Item øCLK-VOUT 1 øCLK-VOUT 2 øCLK-VOUT* (with S/H)
Symbol t10 t11 t12
Min. 40 55 10
Notes: 1) fck = 1MHz, øCLK pulse duty = 50%, øCLK pulse rise/fall time = 10ns 2) Output waveform when internal S/H is in use. 3) • indicates the correspondence of clock pulse and data period.
–8–
Typ. 115 120 165
Max. 280 205 240
Unit ns
ILX511
Spectral Sensitivity (typ.) (Ta = +25°C) 1.0
Relative Sensitivity
0.8
0.6
0.4
0.2
0 400
500
600
700 800 Wavelength (nm)
Spatial Frequency (cycles/mm) 7.1 14.3 21.4 28.6
1000
Dark Voltage Rate vs. Ambient Temperature (typ.)
MTF of main scanning direction (typ.) 0
900
35.7
1.0 10.0 Dark Voltage Rate
H — MTF
0.8 0.6 0.4
1.00
0.2 0
0.10 0
0.2
0.4
0.6
0.8
1
0
Normalized Spatial Frequency τ = 560nm
–9–
10
20 30 40 50 Ta — Ambient Temperature (°C)
60
ILX511
Current Consumption Rate vs. Clock Frequency (typ.)
Output Voltage Rate vs. Integration Time (typ.)
2.0
Current Consumption Rate
Output Voltage Rate
5
1
1.5
1.0
0.5
0.1
0 1
10
50
0
τ int — Integration Time (ms)
1.5
2.0
Offset Level vs. Ambient Temperature (typ.) 3.2 VOS — Offset Level (V)
3.2 VOS — Offset Level (V)
1.0
Clock Frequency (MHz)
Offset Level vs. V DD (typ.)
3.0
2.8
2.6
2.4 4.5
0.5
4.75
5 VDD (V)
5.25
5.5
3.0
2.8
2.6
2.4
–10–
0
20 40 Ta — Ambient Temperature (°C)
60
ILX511
Application Circuit (Without S/H Mode (Note)) 10µ/16V 5V
+
22
21
20
19
18
17
16
15
14
13
12
VDD
VDD
VDD
GND
VGG
GND
GND
V DD
NC
NC
GND
VOUT
GND
GND
SHSW øCLK
VDD
NC
NC
V DD
NC
øROG
1
2
3
6
7
8
9
10
11
4
5
+
3KΩ øCLK
øROG
0.01µ
22µ/10V
Output Signal 2SA1175
Note) This circuit diagram is the case when internal S/H is not used.
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party and other right due to same.
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ILX511
c) Be aware that any of the following can cause the glass to crack because the upper and lower ceramic layers are shielded by low-melting glass: (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with a soldering iron. (3) Rapid cooling or heating. (4) Applying a load or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered.
Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling, be sure to take the following protective measures: a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use a grounding band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensors. e) For the shipment of mounted substrates use cartons treated for the prevention of static charges. 2) Notes on handling CCD CERDIP package The following points should be observed when handling and installing this package: a) (1) Compressive strength: 39N/surface (do not apply any load more than 0.7mm inside the outer perimeter of the glass portion) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive.
Upper Ceramic Layer
Lower Ceramic Layer
39N
(1)
Low-Melting Glass
3) Soldering a) Make sure the package temperature does not exceed +80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount image sensors, do not use solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type.
29N
29N
(2)
(3)
–12–
0.9Nm
(4)
ILX511
4) Dust and dirt protection a) Operate in clean environments. b) Do not touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface blow it off with an air blower. (For dirt stuck through static electricity, ionized air is recommended.) c) Clean with a cotton swab and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences.
Package Outline
5) Exposure to high temperature or humidity will affect the characteristics. Accordingly, avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subjected to mechanical shocks. 7) Make sure the input pulse should not be –1V or below. 8) Normal output signal is not obtained immediately after device switch on. Use the output signal added 22500 pulses or above to øCLK clock pulse.
Unit: mm 22-pin DIP (400mil)
PACKAGE STRUCTURE PACKAGE MATERIAL
CERDIP
LEAD TREATMENT
TIN PLATING
LEAD MATERIAL
42ALLOY
PACKAGE WEIGHT
5.2g
1. Distance of the first pixel: (H, V) = (6.46 ± 0.8mm, 5.0 ± 0.5mm) 2. The height from the bottom to the sensor surface is 2.45 ± 0.3mm 3. The thickness of the cover glass is 0.8mm and the refractive index is 1.5
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