Magnetic Current Imaging - eufanet

Oct 4, 2006 - Superconducting Quantum. Interference Device (SQUID). – Voltage change due to magnetic flux through SQUID. – High sensitivity to weak ...Missing:
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Magnetic Current Imaging

Magma

EUFANET meeting October 4, 2006

What is Magnetic Current Imaging?



It is the best known method for imaging weak buried currents in a non-destructive way.

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System in Package Challenges

Bumpless Buildup Layer (BBUL) Die buried in the packaging

Stacked Chip 3

How does Magma Work? Magma produces a current density image

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Magnetic Sensors



Superconducting Quantum Interference Device (SQUID) – Voltage change due to magnetic flux through SQUID – High sensitivity to weak currents at a distance – Best for packaged devices



Bz

Magnetoresistive sensors – Resistance change due to magnetic field – High resolution when close to current source – Best for front-side accessible die

Bz 5

Comparison between Sensors 10000 10 mA

Current

11000 mA 100 100 µA 10 10 µA

3 200

M

t e n ag

e v i t s i s o re S

1 µA 1 100 nA 0.1 0.1

ID U Q

6 200

Front Side

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Back Side

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Packaging

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Separation Distance (μm)

1000 6

Magma C30

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C4 Bump Short on Flex Cable Current Overlaid on Optical

Processed X-Ray

Optical

Courtesy of David Vallett, IBM

X-Ray

SEM

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Triple-Stacked Die with Pin Short

Pacheco, Intel, ISTFA 2004

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Magnetic Current Imaging Analysis

Pacheco, Intel, ISTFA 2004

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Dual Stacked Die with High Resistance Image Difference Analysis result Broken Bond Wire

Pacheco, Intel, ISTFA 2004

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High Resolution Imaging

• • •

Following slides show images with a magnetoresistive sensor Needs to be close to the source for high resolution Can achieve nano-scale resolution

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High Aspect Ratio Magnetoresistive Sensor Probe ƒFor cavity scanning and scanning near wire bonds or probes ƒBoth in-contact and out-of-contact scanning

Laser milled cavity in Flip-Chip device Cavity: 500µm x 500µm x 250µm deep 13

Wire Bonded Device

Current Density Image

Overlay on Optical Image

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Implementation Model

• • • • •

Global scan with SQUID Isolate defective die, bump, wire bond, package, etc. Locally deprocess with laser, FIB, chemical / mechanical means Image with magnetoresistive sensor Finish physical FA

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