GSM TELEPHONE SGH-X450
SERVICE GSM TELEPHONE
Manual
CONTENTS 1.
Specification
2.
Circuit Description
3.
Exploded Views and Parts List
4.
Electrical Parts List
5.
Block Diagrams
6.
PCB Diagrams
7.
Flow Chart of Troubleshooting
ELECTRONICS
ⓒ Samsung Electronics Co.,Ltd. April. 2004 This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable Printed in Korea. International and/or domestic law.
Code No.: GH68-04745A BASIC.
1. SGH-x450 Specification 1. GSM General Specification GS M9 0 0 Ph a se 1
E GS M 9 0 0 Ph a se 2
DC S 1 8 0 0 P h as e 1
PC S1 9 0 0
F r eq . B a n d [M Hz ] Up l in k / Do w n li n k
8 9 0 ~9 1 5 9 3 5 ~9 6 0
8 8 0 ~9 1 5 9 2 5 ~9 6 0
1 7 1 0 ~1 7 8 5 1 8 0 5 ~1 8 8 0
1 8 5 0 ~1 9 1 0 1 9 3 0 ~1 9 9 0
A RF C N r a n g e
1 ~1 2 4
0~124 & 9 7 5 ~1 0 2 3
5 1 2 ~8 8 5
5 1 2 ~8 1 0
T x /R x s p ac in g
4 5 MHz
4 5 MHz
9 5 M Hz
8 0 MH z
Mo d . B i t r at e/ Bi t Pe r i o d
270.833kbps 3.692us
2 7 0 .8 3 3 k b p s 3 .6 9 2 u s
270.833kbps 3.692us
2 7 0 .8 3 3 k b p s 3 .6 9 2 u s
Ti me Sl o t P er io d / F r am e P er i o d
576.9us 4 .6 1 5 m s
5 7 6 .9 u s 4 .6 1 5 m s
576.9us 4 .6 1 5 m s
5 7 6 .9 u s 4 .6 1 5 ms
Mo d u l a ti o n
0 .3 G MS K
0 .3 G MS K
0 .3 GM SK
0 .3 GM SK
M S P o we r
3 3 d Bm ~1 3 d B m
3 3 d Bm ~5 d B m
3 0 d B m ~0 d B m
3 0 d B m~0 d B m
Po w er C l as s
5 p cl ~ 1 5 p c l
5pcl ~ 19pcl
0pcl ~ 15pcl
0pcl ~ 15pcl
Se n si t iv i t y
-102dBm
- 1 0 2 d Bm
-100dBm
-100dBm
TDM A M u x
8
8
8
8
C el l Ra d iu s
3 5 Km
3 5 Km
2 Km
-
1-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Specification
2. GSM TX power class TX Power control level
GSM900
TX Power
DCS1800
control level
TX Power control level
PCS1900
5
33±2 dBm
0
30±2 dBm
0
30±2 dBm
6
31±2 dBm
1
28±3 dBm
1
28±3 dBm
7
29±2 dBm
2
26±3 dBm
2
26±3 dBm
8
27±2 dBm
3
24±3 dBm
3
24±3 dBm
9
25±2 dBm
4
22±3 dBm
4
22±3 dBm
10
23±2 dBm
5
20±3 dBm
5
20±3 dBm
11
21±2 dBm
6
18±3 dBm
6
18±3 dBm
12
19±2 dBm
7
16±3 dBm
7
16±3 dBm
13
17±2 dBm
8
14±3 dBm
8
14±3 dBm
14
15±2 dBm
9
12±4 dBm
9
12±4 dBm
15
13±2 dBm
10
10±4 dBm
10
10±4 dBm
16
11±3 dBm
11
8±4dBm
11
8±4dBm
17
9±3dBm
12
6±4 dBm
12
6±4 dBm
18
7±3 dBm
13
4±4 dBm
13
4±4 dBm
19
5±3 dBm
14
2±5 dBm
14
2±5 dBm
15
0±5 dBm
15
0±5 dBm
1-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
2. SGH-X450 Circuit Description 1. SGH-X450 RF Circuit Description
1) RX PART 1. ASM(U201) → Switching Tx, Rx path for E`GSM900, DCS1800 and PCS1900 by logic controlling. 2. ASM Control Logic (U501, U502, U503) → Truth Table VC1
VC2
VC3
GSM Tx Mode
H
L
L
DCS / PCS Tx Mode
L
H
L
PCS Rx Mode
L
L
H
GSM / DCS Rx Mode
L
L
L
3. FILTER To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band. - GSM FILTER (C220,C221,L204) → For filtering the frequency band between 925 ~ 960 MHz - DCS FILTER (C218,C219,L203) → For filtering the frequency band 1805 and 1880 MHz. - PCS SAW FILTER (F200) → For filtering the frequency band between 1930 and 1990 MHz 4. TC-VCXO (OSC100) To generate the 13MHz reference clock to drive the logic and RF. After additional process, the reference clock applies to the U100 Rx IQ demodulator and Tx IQ modulator. The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock mode for GPRS high class operation. 5. SI 4205 (U100) This chip integrates three differential-input LNAs. The GSM input supports the E-GSM, DCS input supports the DCS1800, PCS input supports the PCS1900. The LNA inputs are matched to the 200 ohm differential output SAW filters through eternal LC matching network. Image-reject mixer downconverts the RF signal to a 100 KHz intermediate frequency(IF) with the RFLO from frequency synthesizer. The RFLO frequency is between 1737.8 ~ 1989.9 MHz. The Mixer output is amplified with an analog programmable gain amplifier(PGA), which is controlled by AGAIN. The quadrature IF signal is digitized with high resolution A/D converts (ADC). Also, this chip down-converts the ADC output to baseband with a digital 100 KHz quadrature LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interface signals. After channel selection, the digital output is scaled with a digital PGA, which is controlled with the DGAIN. DACs drive a differential analog signal onto the RXIP, RXIN, RXQP, RXQN pins to interface to standard analog-input baseband IC.
2-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
2) TX PART Baseband IQ signal fed into offset PLL, this function is included inside of U100 chip. SI4205 chip generates modulator signal which power level is about 1.5dBm and fed into Power Amplifier(U200). The PA output power and power ramping are well controlled by Auto Power Control circuit. We use offset PLL below
200kHz offset 30 kHz bandwidth
400kHz offset 30 kHz bandwidth
Modulation Spectrum
600kHz ~ 1.8MHz offset 30 kHz bandwidth
GSM
-35dBc
DCS
-35dBc
PCS
-35dBc
GSM
-66dBc
DCS
-65dBc
PCS
-66dBc
GSM
-75dBc
DCS
-68dBc
PCS
-75dBc
2. Baseband Circuit description of SGH-X450 1) PSC2106 1. Power Management Seven low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system performance and long battery life.A programmable LDO provides support for 1.8V, 3.0V SIMs, while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as two LED drivers and two call-alert drivers, aid in reducing both board area and system complexity.A four-wire serial interface unit(SIU) provides access to control and configuration registers. This interface gives a microprocessor full control of the PSC2106 and enables system designers to maximize both standby and talk times. Error reporting is provided via an interrupt signal and status register.Supervisory functions. including a reset generator, an input voltage monitor, and a thermal monitor, support reliable system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature). 2. Battery Charge Management A battery charge management block, incorporating an internal PMOS switch, and an 8-bit ADC, provides fast, efficient charging of single-cell Li-Ion battery. Used in conjunction with a current-limited voltage source, this block safely conditions near-dead cells and provides the option of having fast-charge and top-off controlled internally or by the system's microprocessor.
2-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
3. Backlight LED Driver The backlight LED driver is a low-side, programmable current source designed to control the brightness of the keyboard and LCD illumination.
LED1_DRV is controlled via LED1_[0:2] and can be programmed to sink from 15mA to 60mA in
7.5mA steps. LED2_DRV is controlled via LED2_[0:2] and can be programmed to sink from 5mA to 40mA in 5mA steps. Both LED drivers are capable of sinking their maximum output current at a worst-case maximum output voltage of 0.6V. For efficient use, the LEDs is connected between the battery and the LED_DRV output. 4. Vibrator Motor Driver The vibrator motor driver is a low-side, programmable voltage source designed to drive a small dc motor that silently alerts the user of an incoming call. The driver is controlled by VIB[0:1] and can be programmed to maintain a motor voltage of 1.3V, 2.0V, or 2.5V(relative to VBAT) while sinking up to 100mA. For efficient use, the vibrator motor should be connected between the main battery and the VIB_DRV output.
2) Connector 1. LCD Connector LCD is consisted of main LCD(color 65K UFB LCD). Chip select signals of EMI part in the trident, CLCD_EN, can enable main LCD. LED_EN signal enables white LED of main LCD and EL_EN signal enables dimming mode of main LCD. These two signals are from IO part of the DSP in the trident. RST signal from 2106 initiates the initial process of the LCD. 16-bit data lines(D(0)~D(15)) transfers data and commands to LCD through emi_filter. Data and commands use A(2) signal. If this signal is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output state to LCD, is required. But this system is not necessary this signal. So CP_WEN signal is used to write data or commands to LCD. Power signals for LCD are +VBATT and VCCD. SPK1P and SPK1N from CSP1093 are used for audio speaker. And YMU_VIB_EN from MA-3 enables the motor. 2. JTAG Connector Trident has two JTAG ports which are for ARM core and DSP core(DSP16000). So this system has two port connector for these ports. Pins' initials for ARM core are 'CP_' and pins' initials for DSP core are 'DSP_'. CP_TDI and DSP_TDI signal are used for input of data. CP_TDO and DSP_TDO signals are used for the output of the data. CP_TCK and DSP_TCK signals are used for clock because JTAG communication is a synchronous. CP_TMS and DSP_TMS signals are test mode signals. The difference between these is the RESET_INT signal which is for ARM core RESET.
2-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
3. Keypad connector This is consisted of key interface pins in the trident, KEY_ROW[0~4] and KEY_COL[0~4]. These signals compose the matrix. Result of matrix informs the key status to key interface in the trident. Some pins are connected to varistor for ESD protection. And power on/off key is seperated from the matrix. So power on/off signal is connected with PSC2106 to enable PSC2106. SVC_GREEN, SVC_RED and SVC_BLUE are from OCTL of CSP1093. These signals decide the color of LED, service indicator. Nine key LED use the +VBATT supply voltage. These are connected to BACKLIGHT signal in the PSC2106. This signal enables LEDs with current control. FLIP_SNS informs the status of folder (open or closed) to the trident. This uses the hall effect IC, A3210ELH. A magnet under main LCD enables A3210ELH which is on the main PCB.
4. EMI Filtering This system uses the EMI Filter to reduce noise from LCD part. Some control signals are connected to LCD without EMI filtering.
3) IF connetor It is 23-pin connector, and uses 18-pin at present. They are designed to use SDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, +VBATT and GND. They connected to power supply IC, microprocessor and signal processor IC.
4) Audio AOUTAP, AOUTAN from CSP1093 is connected to the speaker via analog switch. AOUTBP and AOUTBN are connected to the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to the main MIC. And AUXIN and AUXOUT are connected to the Ear-mic. YMU762MA3 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and ADPCM decorder that are included in this device. As a synthesis, YMU762MA3 is equipped 16 voices with differenttones. Since the device is capable of simultaneously generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects. Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the data(playing period) is not limited, so the device can flexiblysupport application such as incoming call melody music distribution service. The hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for example, utilization of various sound effects when using the game software installed in the portable telephone.
2-4
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V). The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous with music. For the headphone, it is provided with a stereophonic output terminal. For the purpose of enabling YMU762MA3 to demonstarte its full capablities, Yamaha purpose to use "SMAF:Synthetic music Mobile Application Format" as a data distribution format that is compatible wiht multimedia. Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents can be written into it including incoming call melody with words that can be used for traning karaoke, and commercial channel that combines texts, images and sounds, and others. The hardware sequencer of YMU762MA3 directly interprets and plays blocks relevant to systhesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.
5) Memory This system uses SHARP's memory, LRS1828. It is consisted of 128M bits flash memory and 32M bits SCRAM. It has 16 bit data line, D[0~15] which is connected to trident, LCD or CSP1093. It has 22 bit address lines, A[1~22]. They are connected too. CP_CSROMEN and CO_CSROM2EN signals, chip select signals in the trident enable two memories. They use 3 volt supply voltage, VCCD. During wrting process, CP_WEN is low and it enables writing process to flash memory and SCRAM. During reading process, CP_OEN is low and it output information which is located at the address from the trident in the flash memory or SCRAM to data lines. Each chip select signals in the trident select memory among 2 flash memory and SCRAM. Reading or writing procedure is processed after CP_WEN or CP_OEN is enabled. Memories use FLASH_RESET, which is buffered signal of RESET from PSC2106, for ESD protection. A[0] signal enables lower byte of SCRAM and UPPER_BYTE signal enables higher byte of SCRAM.
6) Trident Trident is consisted of ARM core and DSP core. It has 20K*16bits RAM 144K*16bits ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted of timer, one bit input/output unit(BIO), JTAG, EMI and HDS(Hardware Development System). ARM core is consisted of EMI, PIC(Programmable Interrupt Controller), reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial Interface), ACCs(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface. DSP_AB[0~8], address lines of DSP core and DSP_DB[0~15], data lines of DSP core are connected to CSP1093. A[0~20], address lines of ARM core and D[0~15], data lines of ARM core are connected to memory, LCD and YMU762. ICP(Interprocessor Communication Port) controls the communication between ARM core and DSP core. CSROMEN, CSRAMEN and CS1N to CS4N in the ARM core are connected to each memory. WEN and OEN control the process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, YMU, Ear-jack, Ear-mic and CSP1093, need the compatible process.
2-5
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Circuit Description
Some PPI pins has many special functions. CP_KB[0~9] receive the status from key FPCB and are used for the communicatios using data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR). And UP_CS/SCLK/SDI, control signals for PSC2106 are outputted through PPI pins. It has signal port for charging(CHG_DET), SIM_RESET and FLIP_SNS with which we knows open.closed status of folder. It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It recieves 13MHz clock in CKI pin from external TCXO and receives 32.768KHz clock from X1RTC. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage. And control signals(DSP_INT, DSP_IO and DSP_RWN) for DSP core are used. It enables main LCD with DSP IP pins.
7) CSP1093 CSP1093 integrates the timing and control functions for GSM 2+ mobile application with the ADC and DAC functions. The CSP1093 interfaces to the trident, via a 16-bit parallel interface. It serves as the interface that connects a DSP to the RF circuitry in a GSM 2+ mobile telephone. DSP can load 148 bits of burst data into CSP1093’ s internal register, and program CSP1093’ s event timing and control register with the exact time to send the burst. When the timing portion of the event timing and control register matches the internal quarter-bit counter and internal frame counter, the 148 bits in the internal Register are GMSK modulated according to GSM 2+ standards. The resulting phase information is translated into I and Q differential output voltages that can be connected directly to an RF modulator at the TXOP and TXON pins. The DSP is notified when the transmission is completed. For receiving baseband data, a DSP can program CSP1093’ s event timing and control register with the exact time to start receiving I and Q samples through TXIP and TXIN pins. When that time is reached, the control portion of the event timing and control register will start the baseband receive section converting I and Q sample pairs. The samples are stored in a double-buffered register until the register contains 32 sample pairs. CSP1093 then notifies the DSP which has ample time to read the information out before the next 32 sample pairs are stored. The voice band ADC converter issues an interrupt to the DSP whenever it finishes converting a 16-bit PCM word. The DSP then reads the new input sample and simultaneously loads the voice band output DAC converter with a new PCM output word. The voice band output can be connected directly to a speaker via AOUTAN and AOUTAP pins and be connected to a Ear-mic speaker via AOUTBN and AOUTBP pins.
8) X-TAL(13MHz) This system uses the 13MHz TCXO, TCO-9141B, Toyocom. AFC control signal form CSP1093 controls frequency from 13MHz x-tal. It generates the clock frequency. This clock is fed to CSP1093,Trident,YMU762 and Silab solution.
2-6
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
3. SGH-X450 Exploded View and its Parts list 1. Cellular phone Exploded View SA MS UN G
Q0032
Q0001
Q0003
Q0005 Q0007
Q0006
Q0008 Q0009 Q0015
Q0010 Q0002
Q0056
Q0014
Q0031
Q0012 Q0030 Q0026 Q0011 Q0020 Q0004
Q0013
Q0056
Q0038
3-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH- X450 Exploded view and its Part list
2. Cellular phone Parts list Location
Description
NO.
SEC CODE
Q0001
MEC FOLDER UPPER
GH75-03608A
Q0002
MEC FOLDER LOWER
GH75-03609A
Q0003
MEC-FRONT COVER
GH75-03607A
Q0004
MEC REAR COVER
GH75-03610A
Q0005
MEC KEYPAD
GH75-04141A
Q0006
UNIT METAL DOME
GH59-01212A
Q0007
LCD
GH07-00490A
Q0008
MOTOR DC
GH30-00077A
Q0009
SPEAKER
3001-001509
Q0010
PBA MAIN
GH92-01595A
Q0011
MEC WINDOW LCD MAIN
GH75-04140A
Q0012
RMO COVER IF CONN
GH73-01844A
Q0013
RMO RF COVER
GH73-02975A
Q0014
MICROPHONE-ASSY
GH30-00090A
Q0015
UNIT FPCB
GH59-01213A
Q0020
ANTENNA
GH42-00374A
Q0026
MEC VOL KEY
GH75-02846A
Q0030
MPR SCREW CAP LEFT
GH74-01466A
Q0031
MPR SCREW CAP RIGHT
GH74-01467A
Q0032
PMO SUB WINDOW
GH72-09526A
Q0038
BATTERY-720MAH
GH43-00940A
Q0056
SCREW MACHINE
6001-001479
3-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
Remark
SGH-X450 Exploded view and its Part list
3. Test Jig (GH80-00865A)
3-1. RF Test Cable
3-2. Test Cable
(GH39-00140A)
3-3. Serial Cable
(GH39-00127A)
3-4. Power Supply Cable
3-5. DATA CABLE (GH39-00143B)
3-6. TA (GH44-00184A)
3-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
4. SGH-X450 MAIN Electrical Parts List SEC Code
Design LOC
1405-001082
V1001
0406-001083
ZD701
1405-001082
V1002
0406-001083
ZD800
1405-001082
V1003
0406-001083
ZD801
1405-001082
V1004
0406-001194
ZD802
1405-001082
V700
0501-000225
Q1000
1405-001082
V705
0504-001151
U503
1405-001082
V706
0504-000168
Q300
1405-001082
V800
0504-001012
Q900
1405-001082
V801
0504-001012
Q901
1405-001082
V802
0504-001012
Q902
1405-001082
V803
0504-001151
U501
1405-001082
V804
0504-001151
U502
1405-001082
V903
0601-001790
D900
1405-001082
V904
0601-001790
D901
1405-001082
V905
0601-001790
D902
1405-001082
V907
0601-001790
D903
1405-001082
V908
0601-001790
D904
1405-001082
V909
0601-001790
D905
1405-001082
V910
0601-001790
D906
1405-001082
V911
0601-001790
D907
1405-001093
V806
0601-001790
D908
1405-001093
V808
0601-001790
D911
1405-001108
V1005
0601-001790
D912,913
1405-001108
V1006
0601-001929
LED900
1405-001108
V1007
1001-001183
U1001
1405-001108
V1008
1009-001010
SW900
1405-001108
V707
1109-001274
U600
1405-001108
V912
1201-002078
U200
1405-001108
V913
1203-002902
U300
1405-001108
V914
1203-003105
U900
2007-000138
R103
1203-003109
U301
2007-000140
R1018
1204-001984
U500
2007-000140
R802
1204-002161
U1013
2007-000140
R803
1205-002433
U100
2007-000140
R804
1404-001256
TH401
2007-000140
R805
1405-001019
V805
2007-000140
R806
1405-001082
V1000
2007-000140
R811
4-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Electrical Parts List
2007-000140
R812
2007-000171
R600
2007-000140
R813
2007-000171
R603
2007-000140
R814
2007-000171
R807
2007-000141
R1011
2007-000171
R911
2007-000141
R1024
2007-000172
R101
2007-000148
R1005
2007-000172
R300
2007-000148
R1006
2007-000172
R407
2007-000148
R1012
2007-000172
R601
2007-000148
R1019
2007-000172
R700
2007-000157
R1025
2007-000566
R810
2007-000157
R305
2007-000947
R302
2007-000157
R400
2007-000758
R303
2007-000157
R402
2007-001119
R1010
2007-000157
R800
2007-001292
R919
2007-000157
R801
2007-001292
R920
2007-000157
R808
2007-001305
R918
2007-000159
R1021
2007-001308
R102
2007-000159
R1023
2007-001325
R1007
2007-000162
R1014
2007-001333
R1017
2007-000162
R1022
2007-002797
R100
2007-000162
R504
2007-003001
R1001
2007-000162
R505
2007-003001
R1002
2007-000162
R506
2007-003010
R900
2007-000162
R910
2007-003010
R901
2007-000167
R304
2007-003010
R902
2007-000171
R1003
2007-003010
R903
2007-000171
R1013
2007-003010
R904
2007-000171
R1027
2007-003010
R905
2007-000171
R1028
2007-003010
R906
2007-000171
R1029
2007-003010
R907
2007-000171
R105
2007-003010
R908
2007-000171
R200
2007-003010
R917
2007-000171
R201
2007-003010
R921
2007-000171
R203
2007-003010
R922
2007-000171
R204
2007-007107
R405
2007-000171
R205
2007-007137
R301
2007-000171
R310
2007-007142
R306
2007-000171
R501
2007-007142
R403
4-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Electrical Parts List
2007-007200
R502
2203-000254
C513
2007-007200
R503
2203-000254
C514
2007-007308
R404
2203-000254
C515
2007-007308
R406
2203-000254
C604
2007-007480
R408
2203-000254
C700
2007-007538
R401
2203-000278
C1020
2007-008263
R308
2203-000359
C1000
2203-000233
C1005
2203-000386
C115
2203-000233
C1028
2203-000386
C414
2203-000233
C1030
2203-000386
C416
2203-000233
C127
2203-000425
C503
2203-000233
C129
2203-000438
C1014
2203-000233
C130
2203-000438
C1021
2203-000233
C131
2203-000438
C1022
2203-000233
C132
2203-000438
C707
2203-000233
C313
2203-000585
C1006
2203-000233
C324
2203-000628
C802
2203-000233
C602
2203-000679
C406
2203-000233
C801
2203-000812
C126
2203-000254
C117
2203-000812
C206
2203-000254
C118
2203-000812
C303
2203-000254
C119
2203-000812
C304
2203-000254
C120
2203-000812
C305
2203-000254
C314
2203-000812
C501
2203-000254
C400
2203-000812
C507
2203-000254
C401
2203-000812
C518
2203-000254
C402
2203-000812
C520
2203-000254
C403
2203-000812
C710
2203-000254
C407
2203-000812
C711
2203-000254
C409
2203-000854
C125
2203-000254
C410
2203-000854
C210
2203-000254
C411
2203-000995
C1039
2203-000254
C412
2203-000995
C215
2203-000254
C417
2203-001072
C1010
2203-000254
C508
2203-001072
C1011
2203-000254
C509
2203-001259
C1008
2203-000254
C510
2203-001405
C408
2203-000254
C511
2203-001412
C116
4-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Electrical Parts List
2203-001598
C311
2203-005496
C213
2203-001598
C312
2203-005496
C214
2203-001598
C315
2203-005496
C404
2203-002677
C218
2203-005496
C413
2203-002677
C219
2203-005496
C505
2203-005052
C1023
2203-005509
C703
2203-005061
C1001
2203-006053
C902
2203-005061
C1002
2203-006137
C1003
2203-005061
C1007
2203-006201
C301
2203-005061
C1015
2203-006201
C309
2203-005061
C300
2203-006201
C310
2203-005061
C302
2203-006201
C316
2203-005061
C320
2203-006201
C903
2203-005061
C322
2203-006257
C306
2203-005061
C405
2404-001088
C307
2203-005061
C418
2404-001105
C212
2203-005061
C506
2404-001105
C318
2203-005061
C600
2404-001134
C207
2203-005061
C601
2404-001268
C1004
2203-005061
C701
2404-001268
C319
2203-005065
C1009
2404-001268
C800
2203-005065
C1032
2404-001305
C1016
2203-005065
C504
2503-001041
C705
2203-005288
C216
2503-001041
C706
2203-005288
C217
2703-002198
L218
2203-005288
C220
2703-002204
L214
2203-005288
C221
2703-002205
L216
2203-005450
C222
2703-002205
L900
2203-005450
C519
2703-002367
L217
2203-005482
C1031
2703-002485
L204
2203-005482
C113
2703-002544
L203
2203-005482
C209
2703-002636
L202
2203-005482
C512
2801-003856
OSC400
2203-005482
C715
2809-001266
OSC100
2203-005482
C900
2901-001268
F701
2203-005482
C901
2901-001268
F702
2203-005496
C128
2901-001268
F703
2203-005496
C211
2901-001268
F704
4-4
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Electrical Parts List
2901-001268
F705
2904-001480
F200
2909-001215
U201
3301-001659
L800
3705-001273
CON201
3709-001244
CN301
3710-001816
CN800
3711-005229
CN1001
3722-001715
CN1000
4302-001157
BAT300
4-5
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
5. SGH-X450 Block Diagrams 1. RF Solution Block Diagram
(F200)
SAW FILTER
DCS RX (1805~1880 MHz)
Si4205 (U100) LNA
LNA
EGSM RX (925~960 MHz)
PGA
ADC
PGA
ADC
Channel Filter
PCS RX (1930~1990 MHz)
Mixer
PGA
DAC
I
PGA
DAC
Q
LNA 100 kHz RF Conector (CON201)
Front End Module
CSP1093
(U201)
RF PLL
IF PLL
DCS TX (1710 ~ 1785 MHz) PCS TX (1850 ~ 1910 MHz)
SDATA SCLK SENB PDNB
Dual PAM (U200) PD
EGSM TX (880 ~ 915 MHz)
(U500)
VCTCXO (OSC100)
LPF
I Q Bryce Park
5-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Block Diagrams
2. Base Band Solution Block Diagram POWER
X-TAL
(LDO,CHARGER,
13MHz
SIM)
GPRS TRIDENT ACC DSP16000 RS232 PPI (Programmable Peripheral I/O) ARM7TDMI
GPIO
X-TAL 32.768KHz ARM
IO RWN AB[8:0] DB[15:0] INT1 IRQx PAx RSTB
DSPJTAG
RTC EMI
JTAG/ICE
FLASH ROM (128M)
SCRAM
IO RWN AB[8:0] DB[15:0] INT1 IRQx PAx RSTB
TXI/Q RX I/Q TXP SERCK SERLE SERDA OCTL DAICK DAIRN DAIDO DAIDI
JTAG
LCD KEYBOARD
JTAG/ICE
CSP1093
DAI
TXIP TXIN TXQP TXQN RXIP RXIN RXQP RXQN SERCK SERLE SERDA RFOVL TXP OCTL
RF SOLUTION -
RF IC PAM MAIN VCO TX VCO IF VCO
Audio Part
Audio
Keypad
LCD
(32M) Motor B'D B'D conn.
Memory part
5-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
6. SGH-X450 PCB Diagrams 1. Main PCB Top Diagram
6-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 PCB Diagrams
2. Main PCB Bottom Diagram
6-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
7. SGH-X450 Flow Chart of Troubleshooting 1. Power On
The set is not ' Power On '
Check the current consumption
No
Current consumption >=100mA
Download again
Yes Check the +VBATT Voltage
No Voltage >= 3.3V
Charge the Battery
Yes Check the pin of U300
No
Check U300 and C310
pin#11 of U300 >= 2.8V Yes
pin#39 of U300 = 2.8V No No
Yes
pin#9 = 1.8V
Check U300 and C309
Yes
Check the clock signal at pin#3 of OSC100 Freq = 13MHz , Vrms ≥ 300mV
No
Check the clock generation circuit (related to OSC100)
Yes Check the initial operation
END
7-1
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
2. Initial
Initialization Failure Yes
No
The pin#9 of U300 = 1.8V and the pin#11 of U300 ≒ 2.825V ?
Check the U300 (If it has some problem, adjust it.)
Yes
No
Is the pin#19 of U300 "Low -> High"?
Check the U300 (If it has some problem, adjust it.)
Yes
No
32.768kHz wave forms at the C414 and C416
Check the U400
Yes No
The pin#22 of U300 is "High"
Check the U300
Yes No
The Voltage is "High" at the C307
Check the U300
Yes No LCD display is O.K
Check the LCD Part
Yes No Sound is O.K
Check the Audio Part
Yes END
7-2
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
3. SIM Part
"Insert SIM" is displayed on the LCD
Yes
No Are there any Signals at pin#52, #53, #54 of U300?
Check the U400
Yes
No Are there any Signals at pin#1, #2, #3, #4 of CN300?
Check the U300
Yes
Check the SIM Card
END
7-3
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
4. Charging Part
Abnormal charging operation
No
The pin#17, #18 of CN800 is TA_VEXT ≒ 5V ?
Replace TA or Check CN800-1
Yes
No The pin#7 of U301 is 3.2~4.2V ?
Check the U301
Yes
The ICHRG = 1.4V(during
No
charging) and ≒ 180mV(full
Solder again or change R306
charging) ?
Yes
END
7-4
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
KEY_COL(2) 3
RTCALARM PWR_KEEP
VRTC
C301 2.2UF
C300 100NF C304 33PF
SIMRST SIMCL K SIMDAT A
C305 33PF
49
C303 33PF
VACC VBAT
44 ADC_AUX1 45 ADC_AUX2 56 ADC_TRI G
54 UP_RST 53 UP_CL K 52 UP_IO
SIM_CLK SIM_RST SIM_VCC
+VBAT T
3 2 1 VEXT 43 BTEMP
51
SIM_IO
50
48
29
M VSI CREF
30
VREF 8
V VIB_DRV
LED1_DRV
LED2_DRV
GNDD
6
T33
T64
C316 2.2UF
VCCD
R305 47K
VREF
R300 10
+VBATT
CHG_DE T CHG_ON
C314 10NF
C315 2.2UF
C318 10UF 6.3V
+VBATT VCCB
RST
C311 2.2UF
C323 4.7uF
VCCA VDD_VIB
C312 2.2UF
+VBATT
VRF
C309 2.2UF
VCCD VCC_1.8A
C307 C310 2.2UF 2.2UF
C313 100PF
VRTC
R301 1.2K,1%
BAT300
ML414R-F9GE
This Document can not be used without Samsung's authorization
C302 100NF
C321 NC
42
VDD67 41
VLDO_7 40
VLDO_6
34
33
32 VL5S_A 31 VL5S_B
VDD5
VLDO_5
12
39
38
37
36 VL4S_A 35 VL4S_B VLDO_4 VDD34
VRTC
VLDO_3
11
R307 NC
10
9
19 RESETN
VLDO_2
VDD12
VLDO_1
GND GND GND GND
5
MAX1508ETA
_EN
VCCD
65 66 67 68
28
GND
7
U300 PSC2106A1WUS-D T
4
_CHG 8
GG GG 9 10 11 12
SAMSUNG Proprietary-Contents may change without notice
CN300 PC-D6-A3-H3.0S 11 6 6 2 2 5 5 33 4 4 G G G G 10 9 8 7
R302 0.051
C320 100NF
T30
46 PWR_SW1N 47 PWR_SW2 13 RTC_ALMN PWR_KEEP PSW1_BUF INTRQ SDI SDO SCLK CSN 21 20 14 15 16 17 18
EN_3 EN_4[0] EN_4[1] EN_5 EN_5A EN_5B RING_PWM
5
POWER
1 VL
ISET
_ACOK6
BATT 7
4
3 GND
2 IN
U301
1
TA_VEXT
PWR_ON JIG_ON
R303 330K
22 23 24 25 26 27 55
57 58 GND GND 59 GND 60 GNDD
61 62 63 64
GND GND GND
C306 470nF
Q
R304 390K
C322 100NF
R306 10K,1%
SIM_CLK
1
R3100
ICHRG
R308 3K,1%
SIM_IO
2
UP_SDI UP_SCLK UP_CS XOENA EN_VPAC YMU_VIB_EN
BACKLIGHT 1 BACKLIGHT 2
C324 100PF
SIM_RST
KEY_ROW(0)
Q300 DTC144EE/TR
TA_VEX T
C319 10UF 10V
7-5 GND
RING_DR
SGH-X450 Flow Chart of Troubleshooting
5. Microphone Part
Microphone does not work
Yes No Is the assembled status of microphone O.K?
Reassemble the microphone
Yes
Check the reference voltage on Mic path
No Solder the microphone again or C1016 ≒ 2.5V
Replace around Mic Circuit (C1009, R1010, R1009, R1006, R1008.....)
Yes
No Is microphone ok ?
Check U500
Yes END
7-6
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
6. Speaker Part There is no sound from Speaker
No
Is the terminal of Speaker O.K.?
Replace the Speaker
Yes
No
Are there any signals at the pin#20 of CN1001, pin#19 of CN1001
Check LCD or Replace CN1001
Yes
The type of sound from the Speaker is Melody
Yes
Are there any signals at the pin#5 and pin#7 of U1001? Yes
The pin#4 of U1001 is "Low"
No
No
No
Are there any signals at the pin#2 and pin#10 of U1001? Yes
Yes
Yes Check U1000
No
The pin#4 of U1001 is "High"
No
Check U1001
Check U500
END
7-7
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
AOUTAP
V1005 AVLC 5S 02 10 0 R1001 10 10 9
NO2 NO1
V+
U1001
COM2
2
1
VCCD
R1022 100K
R1002 10
V1006 AVLC 5S 02 10 0
D(1)
C1005 100PF
C1028 100PF
26
24
23
D4 3
21
D6
20
D7 U1013
19
R MT
18
D3
D5
17
SPOUT
SPOUT
EQ1
EQ2
EQ3
SPVD D
SPVSS
8
9
C PLL NC
VREF C1020 10PF
16 15 14 13 12 11
R1003
R1005 10K
D VD
R1013 0
C1033 NC
V1004
LED
/RST
VSS
R1016 0
C1019 33PF
0
C1000 150PF
VC040205X150R
C1003 22NF
EAR_SPK_P EAR_MIC_ P
JACK_IN
EAR_SPK_N EAR_MIC_ N
C1015 100NF
VCCD
C1007 100NF
HPOUT-L/MON O 10
HPOUT-R
1
7
2
56
YMU762C-QZE2
22
4
YMU_SPK1P
25
2
R1007 3.3K
C1014 1NF
YMU_SPK1N
D1
D0 /WR /CS A0 /RD
1
IOVDD
YMU_VIB_EN
27 28 29 30 31 32
C1006 220PF
D2
D(0) CP_WEN
A(0)
YMU_EN
CP_OEN
CLK13M_YMU YMU_LE D YMU_IRQ RST
D(7)
AOUTAN SPK1N AUDIO_AMP_EN YMU_SPK1 N
MIC1 MIC-SCHX110
C1030 100PF
C1022 1NF
D(6)
3 4 5
4
5
R1027 0
D(5)
IN1
C1001 100NF
C1008
ZD701 ESDA6V1W5
V1008 AVLC 5S 02 10 0
2
3
1
C080D,8PF,50 V
C1011 56PF R1026 0
AOUTBN
JACK_IN
AOUTB P
C1021 1NF
D(4)
NC1
C1009 1UF
R1024 2.2K
R1011 2.2K
EAR_SWITC H
D(3)
COM1
NC2
IN2
GND DG2031
R1006 10K
VCCA
C1031 100NF
C1032 1UF
VCCD
V1003 VC040205X150R
CLKI
/IRQ
V1001
V1002
VC040205X150R
VC040205X150R
V1000 VC040205X150R
R1018 1K
D(2)
8 7 6
R1023 56K
C1026 NC
R1010 680
R1012 10K
3 1
6
5
4
1
2
3
C1004 10UF 10V
+VBATT
R1025 47K
R1021 56K
CN1000 02-828P0-53BKA
C1002 100NF
SAMSUNG Proprietary-Contents may change without notice
SPK1P
C1010 56PF
C1016 33UF
R1014 100K
C1025 NC
Q1000 2SC4617
2
This Document can not be used without Samsung's authorization
YMU_SPK1P
V1007 AVLC 5S 02 10 0
MICIN
MICOUT
AUXIN
AUXOUT
C1023 3.3PF
VCCA
R1017 18K
R1019 10K
7-8
SGH-X450 Flow Chart of Troubleshooting
7. EGSM Reciever CONTINUOUS RX ON RF INPUT : 62CH AMP : -50dBm
NO
NORMAL CONDITION catch the channel?
Check soldered status of C205,C204,L211
YES NO
U201 CHECK pin#13 ≥ -65dBm ?
CON1 resolder or change
YES NO
U201 CHECK pin#1, 2 ≥ -65dBm ?
U201 resolder or change
YES NO
U100 CHECK pin#20,21 ≥ -65dBm ?
C220,C221,L204 resolder or change
YES
U100 CHECK pin38 : 13MHz ? Vp-p : 860mV?
NO
OSC100 CHECK pin#3 : 13MHz ? Vp-p : 950mV?
NO
YES YES C118,R103,C108 resolder
U100 CHECK pin#9 : clean 3V?
NO
U300 pin#39 check or resolder
YES U100 pin#1,2,3,28 Vp-p : 100mV?
NO U100 resolder or change
YES
CHECK U500
7-9
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
OSC100 CHECK pin#4 : clean 3V?
YES OSC100 change or resolder
SGH-X450 Flow Chart of Troubleshooting
8. EGSM transmitter NO
U201 pin#8 : about 2~3 dBm?
U201 pin#11 : 3 V?
NO
U500,U501 check & change
CONTINUS TX ON CONDITION TX POWER DAC:500 CODE APPLIED CH:62 RBW : 100KHz VBW : 100KHz SPAN : 10MHz REF LEV. : 10dBm ATT. : 20dB
YES YES CON1, C215 check&change
NO
C210 ≒ 4~5dBm?
YES U200 check & change
NO
BATTERY, U300 check & change
C207 : 3.7 V?
YES NO
Between R201 & U200 : 1.2V?
U500 check & change
YES
YES NO
NO
R201 check & change
R204 : ≒ -5dBm ?
YES U200 change
NO
U100 pin#9 : 3V ?
YES
U300 pin#39 change or resolder
NO
U100 pin#8 : 13MHz? Vp-p: 950mV
OSC100 pin#3 : 13MHz? Vp-p : 950mV
YES
NO
OSC100 change or resolder
YES
NO
U100 pin#10,12,13,14 : 3V?
U500 check or change
0SC100 pin#4 : 3V ?
NO
U300 pin#39 change or resolder
YES U300 change or resolder
YES NO
U100 pin#5,6,7,8 :1.7V ?
YES
U500 change
U100 change or resolder
7-10
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
9. DCS Receiver CONTINUOUS RX ON RF INPUT : 698CH AMP : -50dBm
NO
NORMAL CONDITION catch the channel?
Check soldered status of C205,C204,L211
YES NO
U201 CHECK pin#13 ≥ -65dBm ?
YES
NO
U201 CHECK pin#3, 4 ≥ -65dBm ?
YES
NO
U100 CHECK pin#18,19 ≥ -65dBm ?
CON1 resolder or change
U201 resolder or change
C218,C219,L203 resolder or change
YES U100 CHECK pin#8 : 13MHz ? Vp-p : 860mV?
NO
OSC100 CHECK pin#3 : 13MHz ? Vp-p : 950mV?
NO
YES
YES YES
U100 CHECK pin#9 : clean 3V?
OSC100 change or resolder
C118,R103,C108 resolder
NO
OSC100 CHECK pin#4 : clean 3V?
U300 pin#39 check or resolder
YES U100 pin#1,2,3,28 Vp-p : 100mV?
NO
U100 resolder or change
YES
CHECK U500
7-11
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
10. DCS transmitter U201 pin#8 : about 2~3 dBm?
NO
U201 pin#9 : 3 V?
NO
CONTINUOUS TX ON CONDITION
U500,U502 check & change
CH : 698CH(DCS),660CH(PCS) TX POWER CODE: 350 CODE Aplied
YES
RBW : 100KHz VBW : 100KHz
YES CON1, C215 check&change
SPAN : 10MHz
L217: ≒ 4~5dBm?
NO
REF LEV. : 10dBm ATT. : 20dB
YES U200 check & change
NO
BATTERY, U100 check & change
C207 : 3.7 V?
YES Between R201 & U200 : 1.2V?
NO
U500 check
YES
YES NO
NO
R201 check & change
R203: ≒ -5dBm ?
YES U200 change or resolder
NO
U100 pin#9 : 3V ?
YES
U300 pin#39 change or resolder
U100 pin#8 : 13MHz? Vp-p : 950mV
NO
OSC100 pin#3 : 13MHz? Vp-p : 950mV
YES
U100 pin#10,12,13,14 : 3V?
NO
OSC100 change or resolder
YES
NO U500 check or change
OSC100 pin#4 : 3V ?
NO
U300 pin#39 change or resolder
YES YES NO
U300 change or resolder
U100 pin#4,5,6,7 :1.7V ?
YES
U500 change
U100 change or resolder
7-12
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
11. PCS Receiver CONTINUOUS RX ON RF INPUT : 698CH AMP : -50dBm
NO
NORMAL CONDITION catch the channel?
Check soldered status of C205,C204,L211
YES NO
U201 CHECK pin#13 ≥ -65dBm ?
YES
NO
U201 CHECK pin#6 ≥ -65dBm ?
YES
NO
U100 CHECK pin#16,17 ≥ -65dBm ?
CON1 resolder or change
U201 resolder or change
near parts of F200 or C218,C219,L203 resolder or change
YES U100 CHECK pin#8 : 13MHz ? Vp-p : 860mV?
NO
OSC100 CHECK pin#3 : 13MHz ? Vp-p : 950mV?
NO
YES
YES YES
U100 CHECK pin#9: clean 3V?
OSC100 change or resolder
C118,R103,C108 resolder
NO
OSC100 CHECK pin#4 : clean 3V ?
U300 pin#39 check or resolder
YES U100 pin#1,2,3,28 Vp-p : 100mV?
NO
U100 resolder or change
YES
CHECK U500
7-13
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
12. PCS transmitter U201 pin#8 : about 2~3 dBm?
NO
U201 pin#9 : 3 V?
NO
CONTINUOUS TX ON CONDITION
U500,U502 check & change
CH : 698CH(DCS),660CH(PCS) TX POWER CODE: 350 CODE Aplied
YES
RBW : 100KHz VBW : 100KHz
YES CON1, C215 check&change
SPAN : 10MHz
L217: ≒ 4~5dBm?
NO
REF LEV. : 10dBm ATT. : 20dB
YES U200 check & change
NO
BATTERY, U100 check & change
C207 : 3.7 V?
YES Between R201 & U200 : 1.2V?
NO
U500 check
YES
YES NO
NO
R201 check & change
R203: ≒ -5dBm ?
YES U200 change or resolder
NO
U100 pin#9 : 3V ?
YES
U300 pin#39 change or resolder
U100 pin#8 : 13MHz? Vp-p: 950mV
NO
OSC100 pin#3 : 13MHz? Vp-p : 950mV
YES
U100 pin#10,12,13,14 : 3V?
NO
OSC100 change or resolder
YES
NO U500 check or change
OSC100 pin#4 : 3V ?
NO
U300 pin#39 change or resolder
YES YES NO
U300 change or resolder
U100 pin#4,5,6,7 :1.7V ?
YES
U500 change
U100 change or resolder
7-14
SAMSUNG Proprietary-Contents may change without notice This Document can not be used without Samsung's authorization
SGH-X450 Flow Chart of Troubleshooting
+VBATT
TXPOWER
TX_EN
TX_BAND_SE L
R200 0
R203 0
R201 0
C207 100UF 6.3V
R202 NC
C209 100NF
C211 220NF
C206 33PF
C213 220NF
C214 220NF
2 3 4 5 6 7 81
U200 SKY77324
19 18 17 16 15 14 13 12
VSEN VCC_CMOS GND PACENA DCS/PCSOUT VCC1 GND BS RSVD DCS/PCSIN GND GSM850/900I N GND GND GSM850/900OUT VCC1
GND11 GND 10 GND 9
6.3V
C212 10UF
VBATT GND VAPC GND GND GND GND
R204 0
20 21 22 23 24 25 26
DPCS_PAM_IN
GSM_PAM_IN
C208 NC
L214 NC
C223 5PF
C210 15PF
GSM_TX_EN DCS_TX_EN PCS_RX_EN
L213 NC
L215 NC
U201
1
13
C 2
ANT
4
G
CON201 KMS-503
3
16
G
56
G
G
C222 5.6pF
C205 10nH
C204 0
L211 NC
2
G
5
G OUT
IN
J_ANT
ANT200
4
F200 FAR-F6EB-1G9600-B2BW 3 OUT 1
L216 3.9nH
C216 1PF
C217 1PF
C218 0.75PF
L202 6.2nH
L203 8.2NH
PCS_LNA_IN_N
PCS_LNA_IN_P
DCS_LNA_IN_N
DCS_LNA_IN_P
GSM_LNA_IN_N
GSM_LNA_IN_P
This Document can not be used without Samsung's authorization
A
C215 47PF
G
PCS_RX 6 DCS_RX_ 1 3 DCS_RX_ 2 4 EGSM_RX_1 1 EGSM_RX_2 2
15
C219 0.75PF
L204 27NH
SAMSUNG Proprietary-Contents may change without notice
G
11 VC1 9 VC2 5 VC3 10 EGSM_T X 8
12 14
DCS/PCS_TX G G G 7
LMG003W-5076A
C220 1PF
C221 1PF
7-15
SGH-X450 Flow Chart of Troubleshooting
RXQP
RXQN
VRF
GND
VDD
GND
XEN DIAG2
DIAG1
D RFO
I SD
SCLK
G RFO RFIDN
XOUT U100
21 20 19 18 17 16 15
GND
RXQ
(From SI4205 )
13MHZ_B B
GND
RFIPP
RFIPN
RFIDP
_SEN
R103 100
N _PD
9 10 11 12 13 14
SI4205-B M
RFIG P
RFIG N
28 27 26 25 24 23 22
P
D VD
C118 10NF
8
GND
C128 220NF
VRF
R101 10
C119 10NF
R105 0
C117 10NF
C115 15PF
C131 100PF
R100 560
C116 30PF
C130 100PF
R102 200
C129 100PF
L900 3.9nH
13MHZ_BB
XOENA
GSM_PAM_I N
DPCS_PAM_IN
GSM_LNA_IN_ N
GSM_LNA_IN_ P
DCS_LNA_IN_ N
DCS_LNA_IN_ P
PCS_LNA_IN_ N
PCS_LNA_IN_ P
SERDAT
SERCL K
SERLE
SAMSUNG Proprietary-Contents may change without notice
C125 39PF
C126 33PF
CLK13M_TR
CLK13M_M C
CLK13M_YM U N
CLK13M_R F
This Document can not be used without Samsung's authorization
34 33 32 31 30 29 GND GND NC NC
1 RXQN
35 36 37 38 GND
RXIP RXIN TXIP TXIN
CLK13M_RF
SI_EN C132 100PF
2 RXIP 3 RXIN 4 TXIP 5 TXIN 6 TXQP
4
TXQP
OSC100
VCO
VCC
N XI
O SD
GND
OUT
VC-TCXO-214C6
3
TXQN C127 100PF
VRF
1
2
7 TXQN
AFC
C120 10NF
7-16