TO-247-2L Package Dimensions

26. ©2001 Fairchild Semiconductor Corporation. October 2001, Rev A. TO-247. 2 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE (FOR RECTIFIERS ONLY).
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TO-247 2 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE (FOR RECTIFIERS ONLY)

INCHES

TERM. 3

A

E

ØS

ØP

MILLIMETERS

SYMBOL

MIN

MAX

MIN

MAX

NOTES

A

0.18

0.190

4.58

4.82

-

b

0.04

0.051

1.17

1.29

2, 3

b1

0.06

0.070

1.53

1.77

1, 2

c

0.02

0.026

0.51

0.66

1, 2, 3

Q ØR D

L1

c b 1

2

2

e1

0.80

0.820

20.3

20.8

-

E

0.60

0.625

15.3

15.8

-

e1

b1

L

D

J1

1 BACK VIEW

0.438 BSC

J1

0.09

0.105

11.12 BSC 2.29 15.7

2.66 16.2

4 5

L

0.62

0.640

L1

0.14

0.155

3.69

3.93

1

-

ØP

0.13

0.144

3.51

3.65

-

Q

0.21

0.220

5.34

5.58

-

ØR

0.19

0.205

4.96

5.20

-

ØS

0.26

0.270

6.61

6.85

-

NOTES: 1. Lead dimension and finish uncontrolled in L 1. 2. Lead dimension (without solder). 3. Add typically 0.002 inches (0.05mm) for solder coating. 4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 6. Controlling dimension: Inch. 7. Revision 2 dated 12-93.

©2001 Fairchild Semiconductor Corporation

26

October 2001, Rev A

TO-247 3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE

A

E

INCHES

TERM. 4 ØS

ØP

MILLIMETERS

SYMBOL

MIN

MAX

MIN

MAX

NOTES

A

0.18

0.190

4.58

4.82

-

b

0.04

0.051

1.17

1.29

2, 3

Q ØR D

L1

b1 c

2

3

e

0.070

1.53

1.77

1, 2

0.09

0.105

2.42

2.66

1, 2

0.66

1, 2, 3

c

0.02

0.026

D

0.80

0.820

20.3

E

0.60

0.625

15.3

e1

b 1

0.06

e

b2 L

b1 b2

3 J1

0.51

0.219 TYP

20.8 15.8 5.56 TYP

0.438 BSC

11.12 BSC

4 4

J1

0.09

0.105

1

L

0.62

0.640

BACK VIEW

L1

0.14

0.155

3.69

3.93

1

ØP

0.13

0.144

3.51

3.65

-

Q

0.21

0.220

5.34

5.58

-

2

e1

2.29 15.7

2.66 16.2

5 -

ØR

0.19

0.205

4.96

5.20

-

ØS

0.26

0.270

6.61

6.85

-

NOTES: 1. Lead dimension and finish uncontrolled in L 1. 2. Lead dimension (without solder). 3. Add typically 0.002 inches (0.05mm) for solder coating. 4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimension D. 5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimension D. 6. Controlling dimension: Inch. 7. Revision 1 dated 1-93.

©2001 Fairchild Semiconductor Corporation

27

October 2001, Rev A